Part number: EP1330 GLManufacturer SKU:
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DescriptionResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling properties. 0.75 gal Pail.
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Product Details
Typical Use: Excellent adhesion to a wide variety of plastics, metals and circuit board materials. Chemical Composition: Epoxy polymer Color: Black Components: 1 part Cure System: Heat Cure Time: 5 to 10min @ 150 °C; 15min @ 120 °C; 30min @ 110 °C; 30 to 45min @ 85 °C Dielectric Strength: 440 V/mil Elongation: 0 to 1% Flash Point: >93 °C Hardness: 90 D Service Temperature: -40 to 150 °C Shear Strength: 1,500 Specific Gravity: 1.93 Tensile Strength: 4,500 psi Thermal Conductivity: 0.94 W/mK Viscosity: 475,000 Volume Resistivity: 8 x 10^14 ohm-cm -
SDS / TDS
