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DescriptionRich algorithm, the combination of 3D, Al and color feature algorithms to optimize the detection rate of the defects. Multiple positioning methods to locate the component precisely. Intelligently compensate for board warpage and detect defects on black components on black board. Adapts to different color PCBs, effectively detect both black and white boards. Marble platform, dual-drive plus motion control card ensure industry-leading inspection speed. Ultra-high range 3D reconstruction technology, capable of measuring components up to 35mm height. The powerful combination of three-point check software and SPC data analysis quickly identifies the root cause of defects.
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Product Details
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SDS / TDS
TDS 3D AOI-Cube