Part number: Sekisui 3D Thermal Gap PadManufacturer SKU:
For current pricing and to place an order please contact your Ellsworth Customer Service Representative.
Call Us Contact Customer Service at +84 08 39260681。
Live Chat Speak with one of our Technical Service Personnel.
Request a Quote Submit a quote request and a Sales Representative will contact you.
Send an Email We will respond within 1 business day.
-
DescriptionSekisui 3D Thermal Gap Pads are moldable, reworkable thermal interface. Featuring a soft, low-hardness design for minimal stress, they provide excellent thermal conductivity, strong electrical insulation (≥10 kV/mm), and UL94 V-0 flame retardancy. The pads can be molded into custom 3-dimensional shapes, allowing them to conform tightly to uneven surfaces and reduce thermal contact resistance. With a wide operating range (−40 °C to +150 °C), low compression set, and precise 3D conformability, these pads deliver safe, reliable, and flexible heat management for high-power automotive and electronic applications. Custom shapes and thicknesses are available upon request, enabling optimized designs for complex product geometries.
-
Product Details
Typical Use: Used for providing thermal interface in EV onboard chargers, BMS, junction boxes, and other modules needing flexible, reworkable pads to bridge nonuniform surfaces with insulation. Brand: Sekisui Polymatech Chemical Composition: Silicone, Thermally Conductive Fillers Grade
Thermal Conductivity (W/m·K)
Hardness (Type E)
Compression Set (%)
Specific Gravity
Breakdown Voltage (kV/mm)
UL94
Temp Range (°C)
FEATHER-S3
1.4
5
25
1.8
>=10
V-0
-40~150
2.2W Type
2.2
15
<16<>
2.8
>=10
V-0 Eq.
-40~150
2.2W Soft
2.2
15
20
2.8
>=10
V-0 Eq.
-40~150
6W Type
6
30
–
>3.0
>=10
V-0 Eq.
-40~150
-
Literature Library
-
Dịch vụ
-
Kiểm soát Chứng Chỉ và Chứng Từ
-
SDS / TDS
.png)
