LOCTITE NS 5540 is a single component, high strength, product whose low viscosity makes it easily brushable onto flanges or threads. It is suitable for sealing flanges up to 20 MPa (2900 psi).

Dymax Corporation expands its range of encapsulant materials with the introduction of Multi-Cure® 9037-F. The product cures in seconds upon exposure to UV/Visible light and has secondary heat cure for shadow areas caused by high-profile components on printed circuit boards.

Dymax Corporation, a leading manufacturer of rapid light-curing materials and equipment, introduces Low Shrink™ OP-81-LS epoxy that cures in seconds upon exposure to broad-spectrum light for fast, precise optical assembly.

The new LOCTITE® PC 9021 shock-absorbing backing material from Henkel has proven its ability to prolong the service life of gyratory and cone crushers throughout Europe. Now available in the UK, this supremely tough and flexible material minimises downtime and enhances productivity of machinery operating in the harshest of environments.

Keo phủ mạch PCB đã phát triển trong những năm gần đây nhằm đáp ứng yêu cầu đặc biệt trong sản xuất bo mạch điện tử. Thành phần của keo hầu hết dựa trên hóa học tương tự nhau bao gồm acrylic, urethane, và acrylated urethane khô bằng UV. Trong đó, Keo HumiSeal® UV20 là sản phẩm mới được cải tiến bởi các chuyên gia polime HumiSeal.